Samsung announced Tuesday that it has developed a new kind of registered 8GB DIMM for the server and enterprise storage markets that is capable of increasing memory density by up to 50 percent. According to the company, this should help combat a future decrease in the number of memory slots found in server and enterprise machines.
The module, which will be based on a 40nm production process, will use a special bonding technique called "through-silicon via" (TSV), which stores memory on the modules by stacking them on top of each other and linking them with copper-filled, micron-sized vertical holes. According to Samsung, this arrangement saves up to 40 percent of the power consumed by a conventional registered DIMM.
Samsung also said that it plans to apply the TSV technology to memory built using even smaller production processes (30nm and below).
Samsung has not yet released any pricing information about the new memory, but has indicated that it should be available to equipment manufacturers by the second half of 2011.
Source: http://www.extremetech.com
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